Stretchable electronics
represent a transformative field that merges the high
performance of traditional rigid electronics with the
flexibility and conformability of soft materials. This
technology enables devices to bend, stretch, and twist
without losing functionality, making it ideal for
applications in biomedicine, wearable health monitors,
and flexible sensors. A key challenge lies in
integrating rigid components, such as silicon-based
complementary metal-oxide-semiconductor (CMOS) chips,
into soft, stretchable substrates. Silicon, with a Young
s modulus of approximately 170 GPa, is far stiffer than
soft materials mimicking human tissue (Young s modulus
~100 kPa), leading to delamination and failure under
strain.
To address this,
researchers have developed innovative strategies, such
as embedding "thick" silicon chips (>10 μm) into
stretchable systems using material gradients. These
gradients gradually transition stiffness between rigid
and soft materials, minimizing stress concentrations at
interfaces. For instance, polydimethylsiloxane (PDMS)
with varying base-to-curing agent ratios has been used
to create intermediate layers that significantly enhance
strain tolerance, achieving up to 140% strain before
failure compared to ~20% for conventional designs.
Finite element analysis and
experimental studies have demonstrated that these
material gradients reduce energy release rates, delaying
crack propagation and delamination. Applications range
from wearable electronics that conform to skin to
advanced biomaterials and flexible actuators. Despite
significant progress, challenges remain in achieving
higher transistor densities and improving organic
semiconductor reliability. Future innovations may
include continuous stiffness gradients or additional
material layers to further refine performance.
This field holds immense
potential for revolutionizing how electronics interact
with the human body and the environment, paving the way
for next-generation technologies in healthcare,
robotics, and beyond.
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This study
addresses the challenge of integrating
rigid silicon-based electronics into
stretchable substrates, a key hurdle in
flexible electronics. By embedding
"thick" silicon chips (>10 μm) and using
material gradients, the authors achieve
enhanced flexibility and durability.
Polydimethylsiloxane (PDMS) with varying
stiffness ratios creates intermediate
layers, reducing delamination risks.
Structures with these gradients
withstand up to 140% strain, compared to
20% for conventional designs. Finite
element analysis and experiments confirm
reduced energy release rates at
interfaces, preventing crack
propagation. This innovation enables
stretchable systems to embed standard
CMOS electronics, paving the way for
advanced wearable health monitors and
biomedical devices.
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